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ECCV’24“协同智能”研讨会征文启事

近年来,具身智能(如自动驾驶和机器人等自主智能体)取得了迅猛发展。然而,由于单个智能体的感知范围和计算资源有限,通常难以独立完成复杂任务。通过多智能体协作和与环境交互,协同智能能够显著提升智能体的智能化水平。因此协同具身智能也已引起行业的广泛关注。

为此,清华大学智能产业研究院联合香港大学、斯坦福大学、上海AI Lab、香港中文大学、慕尼黑工业大学、北京航空航天大学和嬴彻科技等国内外多家单位实验室,将在ECCV 2024大会上联合举办以“协同智能”为主题的自动驾驶和机器人Workshop。

本次Workshop旨在探讨车辆与基础设施之间的通信(V2I)、车辆与车辆之间的通信(V2V),以及多智能体机器人的系统与合作等主题。我们欢迎有关这些主题的研究论文投稿,截稿日期为2024年7月25日。

Selected papers will be published in the proceedings of ECCV 2024, and authors will have the opportunity to present their work during the conference. The best paper will receive a prize of $500, and the runner-up will receive a prize of $300.

Important dates:

Begin submission: June 1, 2024
Deadline: July 25, 2024
Notification: August 8, 2024
Camera ready: August 15, 2024

Submission guidelines:

Submission portal: https://openreview.net/group?id=thecvf.com/ECCV/2024/Workshop/MAAS
Submission follows the guidelines of ECCV 2024: https://eccv2024.ecva.net/Conferences/2024/SubmissionPolicies

Share speakers
During the workshop, renowned experts from universities and enterprises around the world will share their research findings and insights. More speakers are still being confirmed.

Organizing committee

Workshop Organizers

Program Committee
Website: https://coop-intelligence.github.io/

In conclusion, this Workshop provides an excellent platform for researchers to exchange ideas, share experiences, and promote the development of collaborative intelligence. We look forward to seeing you at ECCV 2024!

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